Fanway는 효율적이고 신뢰할 수있는 엔드 투 엔드 PCB 어셈블리 서비스를 제공하는 것을 전문으로하며, 제품 성공을 가속화하기 위해 고유 한 요구 사항에 맞게 정확하게 조정됩니다.
As a long-term supplier of professional surface mount PCB Assembly services for clients across various industries. Fanway specializes in electronic contract manufacturing, we leverage precision SMT equipment and a technical expert team to assist with prototype design, PCBA testing, and high-efficiency manufacturing. Contact us directly to request a quote.
SMT is a process for electronics assembly. The supplied electronic components are mounted to the surface of a PCB (Printed Circuit Board). It is a highly automated and flexible process, enables manufacturer place various components on PCB board.
The advantages of Surface Mount PCB ( SMT Technology) assembly: high assembly density, small size of electronic products, light weight, the volume and weight of the surface mount components are only about 1/10 of those of traditional through-hole components, high reliability, strong vibration resistance, and low defect rate of solder joints.
The surface mount technology (SMT) design and assembly process of PCB (printed circuit board) consists of five basic steps:
1. Preparation
First, operator must ensure the work surface clean and tidy, and wear an anti-static wrist strap and ESD-safe clothing to maintain a safe operating environment in order to static electricity free from damaging components.
2. Solder Paste Printing
Applying solder paste to the PCB is the core process in Surface Mount Technology (SMT). Automated stencil printers deposit the paste, and its deposition quality critically influences solder joint reliability. During application, ensure paste uniformity and appropriate volume to prevent defects like insufficient or excessive deposition. At Fanway, we implement SPI (Solder Paste Inspection) to verify paste volume parameters.
3. Place Components
Place the Surface Mount Device (SMD) components on the Printed Circuit Board (PCB ). Typically, the SMD components will be placed by automatic placement machine efficiently and accurately. The machine uses suction tips to pick up components from trays and precisely positions them at designated locations on the PCB.
4. Reflow Soldering
The components are fixed on the PCB via reflow soldering. The solder paste is heated to melt, thereby firmly welding the components onto the PCB. This process requires precise control of the temperature profile and timing to ensure solder joint integrity.
5. Inspection
Detailed inspection and testing are required after reflow soldering. Ensure all components are properly welded and the circuit boards functions normally, no cold joints and short circuits.
After the welding process is completed, a detailed inspection and testing are carried out to ensure that all components are properly welded and that the circuit board functions normally.
* Complete system assembly
* Material management and control
* Traceability and error prevention management and control
* Testing/ validation/ aging
* Minimum SMT component size: 01005
* Minimum pitch (BGA): 0.2mm
* Minimum PCB size:5050mm
* Maximum PCB size:910600mm
* Best equipment accuracy:+/-25um
* Type: Instrumentation
* Number of Components:136
* Quantity of Components:2729
* Double-sided Lead-free Reflow soldering
* Minimum Package Size: 0402
* Minimum Pin Spacing of Components: 0.4PH QFN
* Type: Industrial Control
* Number of Components: 68
* Quantity of Components: 1131
* Double-sided Lead-free Reflow soldering +Single- sided Wave Soldering
* Number of BGA Soldering: 13
* Minimum Package Size: 0402
* Minimum Pin Spacing of Components: 0.5PH QFN
* Type: Industrial Control Motherboard
* Number of Components: 187
* Quantity of Components: 1920
* Double-sided Lead-free Reflow soldering +Single- sided Wave Soldering
* Minimum Package Size: 0402
* Minimum Pin Spacing of Components: 0.4mm
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